Addresses advanced topics within the processes associated with the manufacture and assembly of printed circuit boards. Addresses advanced issues in bare-board manufacture, including printed circuit board structures and processes, interconnection technology-related considerations, materials and processes used in bare-board manufacture, and reliability issues. The impact of board-pad metallurgies and surface coating on the solder joint is addressed. In the assembly area, the focus is on advanced topics in the surface mount printed circuit board assembly area. Ultrafine pitch assembly and area array assembly are addressed. Topics include solder paste deposition, component and materials issues, solderability, placement, reflow, process yield related issues, the impact of moisture, encapsulation and product reliability. Concepts such as concurrent engineering and design for manufacturing are also addressed. On completion, students have an acceptable understanding of the advanced scientific and/or engineering concepts that relate to the manufacture and assembly of surface mount printed circuit boards. Assists engineers in scientific problem solving and process development for the printed circuit board assembly domain.